Tin Plated Copper Foil

Copper products exposed in the air are prone to oxidation and the formation of basic copper carbonate, which has high resistance, poor electrical conductivity and high power transmission loss; after tin plating, copper products form tin dioxide films in the air due to the properties of tin metal itself to prevent further oxidation.

Products Details

Copper products exposed in the air are prone to oxidation and the formation of basic copper carbonate, which has high resistance, poor electrical conductivity and high power transmission loss; after tin plating, copper products form tin dioxide films in the air due to the properties of tin metal itself to prevent further oxidation. High-precision Rolled Copper Foil, Cu(JIS: C1100/ASTM: C11000) content more than 99.96% 0.035mm~0.15mm (0.0013 ~0.0059inches) ≤300mm (≤11.8 inches) According to customer requirements Electrical appliances and electronics industry, civil (such as: beverage packaging and food contact tools);

Items

Weldable Tin Plating

Non-weld Tin Plating

Width Range

≤600mm (≤23.62inches)

Thickness Range

0.012~0.15mm (0.00047inches~0.0059inches)

Tin layer Thickness

≥0.3µm

≥0.2µm

Tin Content of Tin Layer

65~92%(Can adjust tin content according to customer welding process)

100% Pure Tin

Surface Resistance of Tin Layer (Ω)

0.3~0.5

0.1~0.15

Adhesion

5B

Tensile Strength

Base Material Performance Attenuation after Plating ≤10%

Elongation

Base Material Performance Attenuation after Plating ≤6%

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