Super Thick ED Copper Foils are manufactured by our factory with state-of-the-art technology and high-quality raw materials. Our copper foils are specially designed and engineered to meet the demanding requirements of printed circuit board applications, power electronics, and other high-speed digital communications. Our foils are manufactured using advanced electrolytic deposition (ED) technology, resulting in uniform, low-profile, and high-density copper for improved electrical conductivity, thermal management, and mechanical strength. With thicknesses ranging from 105µm to 500µm, our Super Thick ED Copper Foils offer excellent flexibility, tear resistance, and durability. So, whether you need a reliable copper foil for your project or want to ensure the performance and longevity of your PCBs, our Super Thick ED Copper Foils are the perfect choice!