Copper Strip For Lead Frame

The material for lead frame is always made from alloy of copper, Iron and phosphorus, or copper, nickel and silicon, which have the common alloy No. of C192(KFC),C194 and C7025.These alloys have high strength and performance.C194 and KFC are most representative for copper, iron and phosphorus alloy, they are the most common alloy materials. C7025 is the alloy of copper and phosphorus, silicon. It has high thermal conductivity and high flexibility, and do not need heat treatment, also it’s easy for stamping. It has high strength, excellent thermal conductivity properties, and very suitable for lead frames, especially for assembly of high density integrated circuits.Chemical composition

Name	Alloy No.	Chemical Composition(%)
Name	Alloy No.	Fe	P	Ni	Si	Mg	Cu
Copper-Iron-Phosphorus Alloy	QFe0.1/C192/KFC	0.05-0.15	0.015-0.04	---	---	---	Rem
Copper-Iron-Phosphorus Alloy	QFe2.5/C194	2.1-2.6	0.015-0.15	---	---	---	Rem
Copper-Nickel-Silicon Alloy	C7025	-----	-----	2.2-4.2	0.25-1.2	0.05-0.3	Rem

Technical Parameters

Alloy No.	Temper	Mechanical properties
Alloy No.	Temper	Tensile Strength MPa	Elongation δ≥(%)	Hardness HV	Elctricity Conductivity ％IACS	Thermal Conductivity W/（m.K）
C192/KFC/C19210	O	260-340	≥30	＜100	85	365
	1/2H	290-440	≥15	100-140
	H	340-540	≥4	110-170
C194/C19410	1/2H	360-430	≥5	110-140	60	260
	H	420-490	≥2	120-150
	EH	460-590	----	140-170
	SH	≥550	----	≥160
C7025	TM02	640-750	≥10	180-240	45	180
	TM03	680-780	≥5	200-250
	TM04	770-840	≥1	230-275

Note: Above figures based on the material thickness 0.1~3.0mm.● Lead frame for Integrated Circuits, Electrical connectors, Transistors, LED stents.

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