With the rapid development of technology in society, today's electronic devices need to be light, thin and portable. This requires the internal conduction material not only to achieve the performance of the traditional circuit board, but also must adapt to its internal complex and narrow construction. This makes the flexible circuit board (FPC) application space more and more extensive. However, as the integration of electronic devices increases, the requirements for flexible copper clad laminates (FCCL), the base material for FPC, are also increasing. The special foil for FCCL produced by CIVEN METAL can effectively meet the above requirements. The surface treatment makes it easier to laminate and press the copper foil with other materials, making it a must-have material for high-end flexible PCB substrates.High-precision RA Copper Foil Treated Rolled Copper Foil [HTE] High Elongation ED Copper Foil [FCF] High Flexibility ED Copper Foil [RTF] Reverse Treated ED Copper Foil *Note: All the above products can be found in other categories of our website, and customers can choose according to the actual application requirements. If you need a professional guide, please contact with us.Good flexibility, not easy to break, good laminating performance, easy to form, easy to etch.